Mad_angler1's blog View Details
Archive for July, 2015
Posted by Mad_angler1 | Jul 14, 2015 @ 04:14 PM | 9,892 Views
Folks some time back i ordered one of these cheap parallel charging boards online for the P3.

http://g01.a.alicdn.com/kf/HTB1x1IeH...-phantom-3.jpg



At the time there was a lot of discussions over what to use to power it and can you use DJI's charger.

After i received mine i have been doing some tests,

first thing first the board its self allows you to connect 3 packs, each pack has a 0.22ohm 10W resistor in series with negative to give some overcorrect protection for the packs, the switch they state is to be used when using the original DJI charger, all it does is bypass the resistors and give straight negative to the packs.

the board also has voltage reading and elegant time remaining on charge, iv not looked into these TBH, the voltage reading seems accurate.

As for powering it, DJI Pro adapter is rated at 100w at 17.5v, after investigation and testing it the adapter is current limited to output a maximin of 6A, no matter if you connect 1 or 3 packs the adapter will only provide 6A, whilst charging a single pack up to 50% capacity the battery is taking the full 6A from the adapter, after 50% the current begins to taper off as the charger level increases, this means when charge a pack the adapter is only providing full output for around 50% of the charge time, the rest of the time its less tapering off as the pack get up to full.


...Continue Reading
Posted by Mad_angler1 | Jul 11, 2015 @ 10:25 AM | 9,408 Views
Hi Folks, a big one this, iv been looking specifically into Apples devices supported by the Pilot app and thermal throttling and shutdown, i wanted to look into some of the possible reasons and ways around it, looking into it i have found a few conclusions,

First of all looking at Apple A7 devices, the Mini 2/3 iPhone 5S and the Air 1st gen.

Looking at the design both are similar with the batteries located next to the logic board, The SOC on both is located under a metal EMF shielding, this does not seem to offer any substantial heat dissipation, no thermal compound is used and it does not make contact with the SOC directly.

The interesting thing is all of the packages on the logic board are located facing up towards the screen, This means Apple are not making use of the Aluminium shell as part of a heat sink, the second thing with this is heat from the display is also reflected back towards the processors as well.

Ipad Mini


https://d3nevzfk7ii3be.cloudfront.net/igi/OaqPYROb6isFW4oP][/URL]

Ipad Air


https://d3nevzfk7ii3be.cloudfront.net/igi/tVQvayERBfCgAUcC.huge][/URL]

The A7 SOC , there are 2 versions of this SOC, a different chip in the Air than in the Mini 2/3 iPhone 5S. Its a Duel Core clocked at 1.3ghz in the Mini2/3/5S and 1.4Ghz in the Air.

The A7 in the Mini is a POP setup with the 1GB of ram stacked on top of the core as part of the chip, this is one unit with no metal heat spreader on top.



https://upload.wikimedia.org/...Continue Reading