Originally Posted by Race Miata
Interconnect between split-pack design adds resistance and thus voltage drop between cell #3 and 4 (for a 6S pack). When high current goes thru' interconnection during charging, cell #4 shows higher voltage than the actual cell voltage so balancer bleeds voltage off of cell #4. When current drops later in CV phase, the voltage drop across the interconnection also drops and now balancer realizes cell #4 is under voltage and under charge so it bleeds voltage off all 5 other cells.
ok, I understand the consequences of a higher resistance in the interconnect now.
Is this higher resistance due to the extra bullet connection? Could it be eliminated with replacing bullets with solder bridge?
In other words, is a solder bridge equal (enough) to the direct cell tab2tab connections between other cells?